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Showing results 32 to 40 of 40

32
Improvement of CIGS microstructure and its effect on the conversion efficiency of CIGS solar cells

Kim, KH; Kim, MS; Ahn, Byung Tae; Yoon, JH; Yoon, KH, 2006 IEEE 4th World Conference on Photovoltaic Energy Conversion, WCPEC-4, pp.575 - 578, 2006-05-07

33
LiNbO3 ferroelectric properties on high-and moderate-doped Si substrates

Jung, SW; Kim, YS; Jeong, SH; In, Y; Kim, KH; No, Kwangsoo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.42, pp.S1386 - S1390, 2003-04

34
Low-temperature preparation of boron-doped nanocrystalline SiC : H films using mercury-sensitized photo-CVD technique

Myong, SY; Kim, TH; Lim, KS; Kim, KH; Ahn, Byung Tae; Miyajima, S; Konagai, M, SOLAR ENERGY MATERIALS AND SOLAR CELLS, v.81, no.4, pp.485 - 493, 2004-03

35
MBE growth of wurtzite GaN on LaAlO3 (100) substrate

Lee, JJ; Park, YS; Yang, CS; Kim, HS; Kim, KH; Kang, KY; Kang, TW; et al, JOURNAL OF CRYSTAL GROWTH, v.213, no.1-2, pp.33 - 39, 2000-05

36
Pore Filling and Microstructure Development during the Liquid Phase Sintering

Kang, Suk-Joong L; Kim, KH; Yoon, DN, ADVANCED STRUCTURAL MATERIALS, pp.393 - 399, 1991-02

37
Room-temperature growth of Cu thin films by nozzle-type partially ionized beam deposition with various acceleration voltages

Koh, SK; Yoon, YS; Kim, KH; Jung, HJ; Lee, JeongYong, THIN SOLID FILMS, v.278, no.1-2, pp.45 - 48, 1996-05

38
The electronic structures of epitaxial CrSi2 film prepared on Si(111) substrate

Kim, KH; Kang, JS; Choi, CK; Lee, JeongYong; Olson, CG, APPLIED SURFACE SCIENCE, v.150, no.1-4, pp.8 - 12, 1999-08

39
Thermal compatibility studies of U3Si2 dispersion fuels prepared with centrifugally atomized powder

Kim, KH; Park, JM; Kim, CK; Hofman, GL; Paik, Kyung-Wook, JOURNAL OF NUCLEAR MATERIALS, v.270, no.3, pp.315 - 321, 1999-04

40
Transformation behavior of supercooled austenite during hot deformation of plain medium carbon steel within (gamma+alpha) 2-phase field at a low strain rate

Kim, KH; Chung, JH; Park, Joong Keun, 5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2006, pp.4626 - 4631, 123, 2006-07-04

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