Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Kim, JY
Showing results 23 to 49 of 49
| High Strain-Rate Deformation Behavior of NiAl/Ni Micro-Laminated Composites Hong, Soon Hyung; Kim, HY; Kim, JY; Jeong, DS; Enoki, M, The Korean Society for Composite Materials, pp.237 - 240, 복합재료학회, 2004 |
| Impact Reliabilities of Lead-free Solder Joints with Ni(P), Cu and Ni metallizations Yu, Jin; Sohn, YC; Kim, JY; Jee, YK; Ko, YH, ICEP 2006, 2006 |
| Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations Jee, YK; Kim, JY; Yu, Jin; Lee, TY, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.S1-b p3 -, 2007-11-19 |
| Interfacial Reactions between Lead-free Solders and Ni/Cu Dual-layer UBM Yu, Jin; Kim, JY; Sohn, YC, Micro System Technologies 2005 Proceedings, pp.337 - 344, 2005 |
| Investigation of electroplated Ni and Ni-Cu alloy UBM (Under Bump Metallurgy) with lead-free solders for flip chip packages Kim, SH; Kim, JY; Yu, Jin, 2002 International Symposium on Microelectronics, v.4931, pp.251 - 255, 2002-09-04 |
| Investigation of the characteristic changes on SrTiO3 : Pr,Al,Ga phosphors during low voltage electron irradiation Kim, JY; You, YC; Jeon, DukYoung; Yu, I; Yang, HG, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.21, no.1, pp.536 - 539, 2003-02 |
| Investigation of the characteristic changes on the SrTiO3 : Pr,Al,Ga phosphors during the low voltage electron irradiation Kim, JY; You, YC; Jeon, Duk Young; Yu, I; Yang, HG, Proceedings of the 14th International Vacuum Microelectronics Conference, pp.213 - 214, IEEE, 2001-08-12 |
| Luminescence mechanism of nano-size YVO4:Eu and Gd doped YVO4:Eu phosphors with enhanced luminescence Jeon, DukYoung; Kang, JH; Nazarov, M; Kim, JY, International Vacuum Nanoelectronics Conference, pp.P.2.13 -, 2004 |
| Morphology and cathodoluminescence of Li-doped SrTiO3:Pr3+,Ga3+, a red phosphor operating at low voltages Kim, JY; Jeon, Duk Young; Kang, SG; Kang, SY; Suh, KS, Luminescent and Lumiescent Materials, v.667, pp.G3.7.1 - G3.7.5, 2001-04-17 |
| Nanoscale continuous In2O3 coating on phosphor particles for improved low-voltage cathodoluminescent properties Kim, JY; You, YC; Kang, JH; Jeon, DukYoung; Yu, I, JOURNAL OF MATERIALS RESEARCH, v.18, no.7, pp.1505 - 1508, 2003-07 |
| New perspective in degradation mechanism of SrTiO3 : Pr,Al,Ga phosphors Kim, JY; You, YC; Kang, JH; Jeon, DukYoung; Weber, J, JOURNAL OF MATERIALS RESEARCH, v.19, no.9, pp.2694 - 2698, 2004-09 |
| Orientations of polycrystalline ZnO at the buried interface of oxide thin film transistors (TFTs): A grazing incidence X-ray diffraction study Kim, JY; Ko Park, Sang-Hee; Jeong, HY; Park, C; Choi, SY; Choi, JY; Han, SH; et al, BULLETIN OF THE KOREAN CHEMICAL SOCIETY, v.29, no.4, pp.727 - 728, 2008-04 |
| P and As implantation enhanced formation of metal-free oxide on WSi2 Lee, JG; Kim, JY; Lee, JeongYong; Roh, JS; Huh, JS, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.12A, pp.7140 - 7145, 1997-12 |
| Preparation and characterization of ZnGa2O4 phosphor synthesized with an optimized combustion process Kim, JY; Kang, JH; Lee, DC; Jeon, DukYoung, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.21, pp.532 - 535, 2003-01 |
| Preparation and characterization of ZnGa2O4 phosphor synthesized with an optimized combustion process Kim, JY; Lee, DC; Kang, JH; Jeon, Duk Young, 14th International Vacuum Microelectronics Conference, pp.211 - 212, Vacuum Microelectronics Conference, 2001-08-12 |
| Relaxation of cathodoluminescent characteristics of phosphors at low-energy electron excitation Bukesov, SA; Kim, JY; Jeon, DukYoung; Strel'tsov, AV, JOURNAL OF APPLIED PHYSICS, v.91, no.11, pp.9078 - 9082, 2002-06 |
| Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| Soft materials nanoengineering by directed molecular assembly Jeong, SJ; Kim, JY; Moon, HS; Kim, Sang Ouk, 2010 10th IEEE Conference on Nanotechnology, NANO 2010, pp.41 - 45, IEEE, 2010-08-17 |
| Structurally Nanocrystalline-Electrically Single Crystalline ZnO-Reduced Graphene Oxide Composites Nam, Woo Hyun; Kim, Bo Bae; Seo, Seul Gi; Lim, Young Soo; Kim, JY; Seo, Won-Seon; Choi, Won Kook; et al, NANO LETTERS, v.14, no.9, pp.5104 - 5109, 2014-09 |
| Superconducting properties of well-shaped MgB2 single crystals Kim, KHP; Choi, JH; Jung, CU; Chowdhury, P; Lee, HS; Park, MS; Kim, HJ; et al, PHYSICAL REVIEW B, v.65, no.10, 2002-03 |
| Surface modification and low voltage cathodoluminescence of SrTiO3:Pr, Al, Ga phospohr Jeon, Duk Young; Kang, JH; Kim, JY; Bukesov, SA, 2004 International Display Workshops, pp.1119 - 1122, 2004 |
| Synthesis and characterization of orange-emitting SnO2 : Eu3+ phosphor by an optimized combustion method Kang, JH; Kim, JY; Jeon, DukYoung, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.152, no.3, pp.33 - 38, 2005 |
| The effect of addition of Gd, La into YVO4:Eu3+ red phosphor Jeon, Duk Young; Kang, JH; Im, WB; Lee, DC; Kim, JY, 2003 International Meeting on Information Display, pp.1017 - 1020, 2003 |
| The effects of electroplating parameters on the composition and morphology of Sn-Ag solder Kim, JY; Yu, Jin; Lee, JH; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1459 - 1464, 2004-12 |
| The effects of surface treatment for ZnS : Ag,Cl using a combination of stirring and ultrasonication in KOH solutions Lee, DC; Bukesov, SA; Lee, S; Kang, JH; Jeon, DukYoung; Park, DH; Kim, JY, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.11, pp.227 - 231, 2004 |
| The effects of surface treatment using stirring & ultrasonication in KOH solutions for blue phosphor ZnS:Ag,Cl Jeon, Duk Young; Lee, DC; Park, DH; Lee, S; Kim, JY, 2003 International Display Manufacturing Conference & FPD expo, pp.703 - 706, 2003 |
| Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process Yu, Jin; Lee, KO; Kim, JY; Park, IS, Proc.3rd Electronic Materials and Packaging, pp.84 - 87, 2001 |
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- 982 1980 - 1989