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Galvanic corrosion behaviors of Cu connected to Au on a printed circuit board in ammonia solution Oh, Se-Kwon; Kim, Youngjun; Jung, Ki Min; Park, Miseok; Shon, MinYoung; Kwon, HyukSang, METALS AND MATERIALS INTERNATIONAL, v.24, no.1, pp.67 - 72, 2018-01 |
Study on the Mechanism and Modeling for Super-filling of High-Aspect-Ratio Features with Copper by Catalyst Enhanced Chemical Vapor Deposition Coupled with Plasma Treatment Kim, Chang-Gyu; Lee, Do-Seon; Lee, Won-Jong, KOREAN JOURNAL OF METALS AND MATERIALS, v.49, no.4, pp.334 - 341, 2011-04 |
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