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Showing results 3 to 8 of 8

3
Filling of very fine via holes for 3D packaging by using ionized metal plasma sputtering and electroplating

CHO, Byeong-Hoon; YUN, Jae-Jin; LEE, Won-Jong, Japanese Journal of Applied Physics, Vol.46, No.46, pp.L1135-L1137, 2007-11-22

4
Filling of very fine via holes for three-dimensional packaging by using ionized metal plasma sputtering and electroplating

Cho, Byeong-Hoon; Yun, Jae-Jin; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.46, no.45-49, pp.L1135 - L1137, 2007-12

5
Hybrid electrophoretic deposition methods for poly(vinylidene fluoride-co-trifluoroethylene) thin films = Poly(vinylidene fluoride-co-trifluoroethylene) 필름의 하이브리드 전기 영동 증착법link

Kim, Yeontae; 김연태; et al, 한국과학기술원, 2015

6
Ionized Metal Plasma Sputtering 및 Cu Electroplating을 이용한 3-D Packaging용 Through-Si Via Filling에 대한 연구 = Through-Si via filling for 3-D packaging by ionized metal plasma sputtering and Cu electroplatinglink

조병훈; Cho, Byeong-Hoon; et al, 한국과학기술원, 2008

7
Low temperature nucleation of the perovskite phase in the deposition of Pb(Zr,Ti)O-3 films on the Pt/SiO2/Si substrate by electron cyclotron resonance plasma enhanced chemical vapor deposition

Kim, Jae Whan; Kim, Hyun Ho; Wee, Dang-Moon; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, v.36, no.7B, pp.936 - 938, 1997-07

8
RF magnetron sputtering법으로 증착된 PZT 박막의 증착특성 및 광소자로의 응용에 관한 연구 = A study on the deposition characteristics and the application to optical devices of the PZT films deposited by RF magnetron sputteringlink

강희수; Kang, Hee-Soo; et al, 한국과학기술원, 2001

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