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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject flip chip

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Showing results 13 to 26 of 26

13	Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12
14	High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application Yim, Myung-Jin; Paik, Kyung-Wook, ELECTRONIC MATERIALS LETTERS, v.2, no.1, pp.7 - 14, 2006-03
15	Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.76 - 82, 2004-01
16	Highly reliable non-conductive adhesives for flip chip CSP applications Yim, MJ; Hwang, JS; Kwon, W; Jang, KW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.26, pp.150 - 155, 2003-04
17	Reduced thermal strain in flip chip assembly on organic substrate using low cte anisotropie conductive film Yim, MJ; Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.23, no.3, pp.171 - 176, 2000-07
18	Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09
19	Review of Electrically Conductive Adhesive Technologies for Electronic Packaging Yim, Myung-Jin; Paik, Kyung-Wook, ELECTRONIC MATERIALS LETTERS, v.2, no.3, pp.183 - 194, 2006-12
20	Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging Yim, Myung Jin; Li, Yi; Moon, Kyoung-sik; Paik, Kyung-Wook; Wong, C. P., JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.22, no.14, pp.1593 - 1630, 2008
21	Stresses in electroless Ni-P films for electronic packaging applications Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03
22	Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528, 2002-05
23	Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01
24	Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection Lee, Ki-Won; Kim, Hyoung-Joon; Yim, Myung-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.4, pp.241 - 247, 2009-10
25	인듐 범프를 이용한 VCSEL 어레이의 플립칩 본딩 최적화 = Optimization of flip chip bonding for a VCSEL array using indium bumps link 주건모; Chu, Kun-Mo; et al, 한국과학기술원, 2003
26	전해도금에 의한 미세 공정 Sn-Bi 솔더 범프 제작에 관한 연구 = Fabrication of small eutectic Sn-Bi solder bumps by electroplating link 정회록; Jung, Hoe-Rok; et al, 한국과학기술원, 2003

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