Showing results 5 to 14 of 14
Effect of film density on electrical properties of indium tin oxide films deposited by dc magnetron reactive sputtering Choi, Si-Kyung; Lee, JI, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.19, no.5, pp.2043 - 2047, 2001-05 |
Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films Song, JY; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.21, no.9, pp.2261 - 2269, 2006-09 |
Highly oriented (Pb, La)TiO3 thin films prepared by sol-gel process Koo, J; Jang, JH; Bae, Byeong-Soo, JOURNAL OF MATERIALS SCIENCE, v.34, no.20, pp.5075 - 5080, 1999-10 |
In situ measurement of the surface stress evolution during magnetron sputter-deposition of Ag thin film Lee, SH; Park, Joong Keun, APPLIED SURFACE SCIENCE, v.253, no.23, pp.9112 - 9115, 2007-09 |
Influence of film density on residual stress and resistivity for Cu thin films deposited by bias sputtering Choi, HM; Choi, Si-Kyung; Anderson, O; Bange, K, THIN SOLID FILMS, v.358, no.1-2, pp.202 - 205, 2000-01 |
Influence of residual stress and film thickness on crystallographic orientation in Al thin films deposited by bias sputtering Choi, HM; Choi, Si-Kyung, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.16, no.6, pp.3348 - 3351, 1998-11 |
Platinum hillocks in Pt/Ti film stacks deposited on thermally oxidized Si substrate Kweon, SY; Choi, Si-Kyung; Yeom, SJ; Roh, JS, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.40, no.10, pp.5850 - 5855, 2001-10 |
Reflow of copper in oxygen anneal ambients Lee, SY; Choi, SH; Kang, JY; Park, Chong-Ook, JOURNAL OF APPLIED PHYSICS, v.88, no.10, pp.5946 - 5950, 2000-11 |
Relationship between domain structure and film thickness in epitaxial PbTiO3 films deposited on Mg(001) by reactive sputtering Choi, WK; Choi, Si-Kyung; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.14, no.12, pp.4677 - 4684, 1999-12 |
Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films Song, Jae Yong; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.482 - 486, 2009-02 |
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