Showing results 3 to 7 of 7
Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11 |
Effects of pd addition on au stud bumps/Al pads interfacial reactions and bond reliability Kim, HJ; Cho, JS; Park, YJ; Lee, J; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.1210 - 1218, 2004-10 |
Pd-doped TiO2 nanofiber networks for gas sensor applications Moon, Jaehyun; Park, Jin-Ah; Lee, Su-Jae; Zyung, Taehyoung; Kim, Il-Doo, SENSORS AND ACTUATORS B-CHEMICAL, v.149, no.1, pp.301 - 305, 2010-08 |
Porous Pd-Sn Alloy Nanotube-Based Chemiresistor for Highly Stable and Sensitive H2 Detection Song, Lu; Ahn, Jaewan; Kim, Dong-Ha; Shin, Hamin; Kim, Il-Doo, ACS APPLIED MATERIALS & INTERFACES, v.14, no.24, pp.28378 - 28388, 2022-06 |
저압 다이아몬드 합성에서 Ni, Fe, Co, Pd 기판에서 형성되는 soot 형성기구와 합성 조건에 따른 다이아몬드의 성장 모양 변화 = Mechanism of soot-formation on Ni, Fe, Co and Pd substrates, and morphology variation of diamond with deposition conditions in CVD of diamondlink 허종무; Huh, Jong-Moo; et al, 한국과학기술원, 2000 |
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