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Showing results 1 to 16 of 16

1	Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints Shin, SW; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.2, pp.188 - 195, 2005-02
2	Creep rupture of lead-free Sn-3.5Ag-Cu solders Joo, DK; Yu, Jin; Shin, SW, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.6, pp.541 - 547, 2003-06
3	Effect of in addition on Sn-3.5Ag solder and joint with Cu substrate Choi, WK; Yoon, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.42, no.5, pp.783 - 789, 2001
4	Effects of Ag on the Kirkendall void formation of Sn-xAg/Cu solder joints Kim, Sung-Hwan; Yu, Jin, JOURNAL OF APPLIED PHYSICS, v.108, no.8, 2010-10
5	Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01
6	Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10
7	Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation Kim, Sung-Hwan; Yu, Jin, SCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257, 2013-08
8	Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10
9	Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2242 - 2250, 2009-11
10	Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.24, pp.3032 - 3037, 2011-12
11	New Sn-0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca Koo, Jahyun; Chang, Jaewon; Lee, Young Woo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.608, pp.126 - 132, 2014-09
12	Rupture time analyses of the Sn-3.5Ag solder alloys containing Cu or Bi Yu, Jin; Joo, DK; Shin, SW, ACTA MATERIALIA, v.50, no.17, pp.4315 - 4324, 2002-10
13	Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints Kim, Sung-Hwan; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.25, no.9, pp.1854 - 1858, 2010-09
14	Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.50, no.9, pp.2291 - 2296, 2009-09
15	Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04
16	Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate Jung, In-Yu; Cho, Moon-Gi; Lee, Hyuck-Mo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2301 - 2307, 2009-11

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