Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation
Sn-3.5Ag-xFe (x = 0.1, 0.5, 1.0 and 2.0 wt.%) solders were reacted with electroplated Cu under bump metallization and the characteristics of Kirkendall void formation at the solder joints were investigated. An electroplating process was carried out in a Cu sulfate bath with an additive. The results show that the formation of Kirkendall voids at the solder joint decreased with the Fe content due to the scavenging of S originating from the additive. (c) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
- Publisher
- PERGAMON-ELSEVIER SCIENCE LTD
- Issue Date
- 2013-08
- Language
- English
- Article Type
- Article
- Keywords
JOINTS; CU; SEGREGATION; RELIABILITY; ZN; SURFACE
- Citation
SCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257
- ISSN
- 1359-6462
- Appears in Collection
- MS-Journal Papers(저널논문)
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