DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Sung-Hwan | ko |
dc.contributor.author | Yu, Jin | ko |
dc.date.accessioned | 2013-08-14T01:08:31Z | - |
dc.date.available | 2013-08-14T01:08:31Z | - |
dc.date.created | 2013-08-09 | - |
dc.date.created | 2013-08-09 | - |
dc.date.issued | 2013-08 | - |
dc.identifier.citation | SCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257 | - |
dc.identifier.issn | 1359-6462 | - |
dc.identifier.uri | http://hdl.handle.net/10203/175010 | - |
dc.description.abstract | Sn-3.5Ag-xFe (x = 0.1, 0.5, 1.0 and 2.0 wt.%) solders were reacted with electroplated Cu under bump metallization and the characteristics of Kirkendall void formation at the solder joints were investigated. An electroplating process was carried out in a Cu sulfate bath with an additive. The results show that the formation of Kirkendall voids at the solder joint decreased with the Fe content due to the scavenging of S originating from the additive. (c) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. | - |
dc.language | English | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.subject | JOINTS | - |
dc.subject | CU | - |
dc.subject | SEGREGATION | - |
dc.subject | RELIABILITY | - |
dc.subject | ZN | - |
dc.subject | SURFACE | - |
dc.title | Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation | - |
dc.type | Article | - |
dc.identifier.wosid | 000320841900013 | - |
dc.identifier.scopusid | 2-s2.0-84878576279 | - |
dc.type.rims | ART | - |
dc.citation.volume | 69 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 254 | - |
dc.citation.endingpage | 257 | - |
dc.citation.publicationname | SCRIPTA MATERIALIA | - |
dc.identifier.doi | 10.1016/j.scriptamat.2013.04.010 | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Aging | - |
dc.subject.keywordAuthor | Annealing | - |
dc.subject.keywordAuthor | Auger electron spectroscopy (AES) | - |
dc.subject.keywordAuthor | Metallizations | - |
dc.subject.keywordAuthor | Segregation | - |
dc.subject.keywordPlus | JOINTS | - |
dc.subject.keywordPlus | CU | - |
dc.subject.keywordPlus | SEGREGATION | - |
dc.subject.keywordPlus | RELIABILITY | - |
dc.subject.keywordPlus | ZN | - |
dc.subject.keywordPlus | SURFACE | - |
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