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Showing results 1 to 9 of 9

1
Ag-Pd 합금의 조직 및 기계적 성질에 미치는 S와 Ir의 영향 = The effects of S and Ir on the structure and mechanical properties in Ag-Pd alloyslink

신승렬; Shin, Seung-Ryoul; et al, 한국과학기술원, 2000

2
Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints

Yu, Jin; Kim, J. Y., ACTA MATERIALIA, v.56, no.19, pp.5514 - 5523, 2008-11

3
Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints

Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10

4
Enhanced thermoelectric properties of NbCoSn half-Heuslers through in-situ nanocrystallization of amorphous precursors during the consolidation process

Jung, Chanwon; Jang, Kyuseon; Park, Hail; Jang, Jeongin; Jang, Hanhwi; Kang, Byungchul; Park, Kitae; et al, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.165, pp.39 - 48, 2023-12

5
Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation

Kim, Sung-Hwan; Yu, Jin, SCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257, 2013-08

6
Grain boundary segregation engineering in metallic alloys: A pathway to the design of interfaces

Raabe, D.; Herbig, M.; Sandloebes, S.; Li, Y.; Tytko, D.; Kuzmina, M.; Ponge, D.; et al, CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE, v.18, no.4, pp.253 - 261, 2014-08

7
Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints

Kim, Sung-Hwan; Yu, Jin, MATERIALS LETTERS, v.106, pp.75 - 78, 2013-09

8
Nanocrystalline Fe-C alloys produced by ball milling of iron and graphite

Chen, Y. Z.; Herz, A.; Li, Y. J.; Borchers, C.; Choi, Pyuck-Pa; Raabe, D.; Kirchheim, R., ACTA MATERIALIA, v.61, no.9, pp.3172 - 3185, 2013-05

9
Segregation and Internal Structures in the Bimetallic Clusters: Density Functional Theory and Molecular Dynamics Simulation

Ryu, Ji-Hoon; Kim, Hyun-You; Kim, Da-Hye; Choi, Si-Kyung; Lee, Hyuck-Mo, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.9, no.4, pp.2553 - 2557, 2009-04

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