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전해도금법을 이용한 공정 납-주석 플립칩 솔더범프와 UBM(Under Bump Metallurgy)계면에 관한 연구 = Interfacial studies on the electroplated eutectic Pb/Sn flip-chip solder bump and UBM(Under Bump Metallurgy)link

장세영; Jang, Se-Young; et al, 한국과학기술원, 1998

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