Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title
Showing results 6001 to 6020 of 19283
| Establishment of SCC criteria of stainless steels for hot water storage tank applications based on repassivation kinetics Kwon, Hyuk Sang, 한국부식방식학회 춘계학술발표대회, pp.30 - 30, 한국부식방식학회, 2006-05-01 |
| Estimates of the photo-response characteristics of a non-fully-depleted silicon p-i-n photodiode for the near infrared spectral range and the experimental results Park, Kun-Sik; Yoon, Yong-Slin; Park, Jong-Moon; Kang, Jin-Yeong; Kim, Bo-Woo; Hwang, In-Gap; No, Kwang-Soo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.50, pp.1156 - 1162, 2007-04 |
| Estimation of order-disorder transition temperature in Pt-Co alloy by Monte Carlo simulation using modified embedded atom method Park, SI; Lee, BJ; Lee, HyuckMo, SCRIPTA MATERIALIA, v.45, no.5, pp.495 - 502, 2001 |
| Estimation of the interfacial fracture energy of metal/polymer system in microelectronic packaging Song, JY; Yu, Jin, 2001 MRS Spring Meeting, v.682, pp.150 - 155, 2001-04-16 |
| Estimations of the Interfacial Fracture Energy of Metal Polymer System in Microelectronic Packaging Yu, Jin; Son, JY, MRS Proc., pp.N6.2.1 -, 2001 |
| Etch mask재료로서의 알루미늄 산화막의 제조 및 에칭특성(초록 No;B-22) 이원종; 김재환, 한국재료학회 춘계학술연구발표회, 1992 |
| Etch-induced damage in single crystal Si trench etching by planar inductively coupled Cl-2/N-2 and Cl-2/HBr plasmas Lee, JeongYong; Hwang, SW; Yeom, GY; Lee, JW; Lee, JY, THIN SOLID FILMS, v.341, no.1-2, pp.168 - 171, 1999-03 |
| Etching Dynamics of Geometrically Confined Silicon Nanostructure Koo, Kunmo; Yuk, Jong Min; Chang, Joon Ha; Ji, Sanghyeon; Choi, Jacob; Shin, Sengmin; Lee, Geun-Taek; et al, 2022 Microscopy and Microanalysis, Microscopy Society of America, 2022-08-02 |
| Etching for microstructural observation of cemented submicrometer-sized carbides Jung, SW; Kim, J; Kang, Suk-Joong L, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.84, no.4, pp.899 - 901, 2001-04 |
| Etching properties of aluminum oxide films prepared by plasma enhanced metal organic chemical vapor deposition : High Performance Ceramic Films and Coatings Lee, Won-Jong; Park, Chong-Ook; Chun, Soung Soon; Kang, CJ; Kim, YC, 7th CIMTEC--World Ceramics Congress, pp.391 - 398, CIMTEC--World Ceramics Congress, 1990-06 |
| Ethylenediamine-Enhanced Oxidation Resistivity of a Copper Surface during Water-Based Copper Nanowire Synthesis Koo, Jahyun; Kwon, Soonho; Kim, Na Rae; Shin, Kihyun; Lee, Hyuck Mo, JOURNAL OF PHYSICAL CHEMISTRY C, v.120, no.6, pp.3334 - 3340, 2016-02 |
| Etude des Martensites des Binaires Cuivre-Aluminium Kang, Suk-Joong L, MECANIQUE-MATERIASUX-ELETRICITE, v.0, no.385, pp.18 - 24, 1982-12 |
| Eu-doped SnO2 as a transparent conductive phosphor layer for CNT emitters Ahn, Byung Tae, International Symposium on Nanomanufacturing, pp.0 - 0, 2004-11-01 |
| Europium-activated rare earth fluoride (LnF(3):Eu3+-Ln=La, Gd) nanocrystals prepared by using ionic liquid/NH4F as a fluorine source via hydrothermal synthesis Kasturi, S; Sivakumar, V; Jeon, Duk Young, LUMINESCENCE, v.31, no.5, pp.1138 - 1145, 2016-08 |
| Eutectic Pb/Sn Solder Bump and Under Bump Metallurgy(UBM) Interfacial Reaction and Adhesion Paik, Kyung-Wook, 2nd electronic Packaging Technology Conference, pp.69 - 75, 1998-03-01 |
| Eutectic Sn/Pb solder bump and under bump metallurgy (UBM) interfacial reaction and adhesion Jang, Se-Young; Paik, Kyung-Wook, SOLDERING & SURFACE MOUNT TECHNOLOGY, v.10, no.3, pp.29 - 37, 1998-03 |
| Evaluation method of longitudinal and transverse piezoelectric d-coefficients for thin films Kim, DG; Kim, Il-Doo; Lee, CH; Park, JH; Choi, KP; Kim, Ho Gi, 12th Interntional Symposium on Integrated Ferroelectrics, v.35, no.40547, 2000-03-12 |
| Evaluation method of longitudinal and transverse piezoelectric d-coefficients for thin films Kim, DG; Kim, Il-Doo; Lee, CH; Park, JH; Choi, KP; Kim, Ho Gi, INTEGRATED FERROELECTRICS, v.35, no.1-4, pp.2029 - 2042, 2001 |
| Evaluation of Ablation Behaviors of HfC-SiC Ultra High Temperature Ceramics (UHTCs) under Oxyacetylene Torch 백창연; 김주형; 성영훈; 김동석; 이제훈; 김도경, 2015 한국세라믹학회 춘계학술대회 및 총회, 한국세라믹학회, 2015-04-17 |
| Evaluation of Aluminum Nitride(AlN) Substrate Material for High Density Interconnect(HDI) Applications Paik, Kyung-Wook, Proceedings of the 1992 International Symposium on Hybrid Microelectronics (ISHM) conference, pp.555 - 560, 1992-03-01 |
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