Showing results 7221 to 7240 of 19389
Formation of high-density CuBi2O4 thin film photocathodes with polyvinylpyrrolidone-metal interaction![]() Kim, Nam Woon; Choi, Byeong-Uk; Yu, Hyunung; Ryu, Sangwoo; Oh, Jihun, OPTICS EXPRESS, v.27, no.4, pp.A171 - A183, 2019-02 |
Formation of hillocks in Pt/Ti electrodes and their effects on short phenomena of PZT films deposited by reactive sputtering Nam, HJ; Choi, DK; Lee, Won-Jong, THIN SOLID FILMS, v.371, no.1-2, pp.264 - 271, 2000-08 |
Formation of intermetallic compounds in the Ni bearing lead free composite solders Lee, JW; Lee, ZH; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2344 - 2350, 2005-11 |
Formation of internal voids in tin anode with cycling Kim, R; Kim, K; Lim, S; Nam, D; Kwon, Hyuk-Sang, 218th ECS Meeting, pp.1093 -, ECS, 2010-10-10 |
Formation of large pores and their effect on electrical properties of SnO2 gas sensors Lee, GG; Kang, Suk-Joong L, Proceedings of the 7th European Conference on Optical Chemical Sensors and Biosensors — EUROPT(R)ODE VII, v.107, no.1, pp.392 - 396, EUROPT(R)ODE, 2004 |
Formation of large pores and their effect on electrical properties of SnO2 gas sensors Lee GG; Kang, Suk-Joong L, SENSORS AND ACTUATORS, B: CHEMICAL, v.107, no.1, pp.392 - 396, 2005-05 |
Formation of lattice defects and oxygen electrocatalysis enhancement in perovskite nickelates = 페롭스카이트 니켈산화물에서 격자결함의 형성과 전기화학적 산소촉매 활성의 향상link Bak, Jumi; Chung, Sung-Yoon; et al, 한국과학기술원, 2021 |
Formation of misfit dislocations and stacking faults in high indium content InxGa1-xN layers grown by metalorganic chemical vapor deposition Cho, HK; Lee, JeongYong; Kim, KS; Yang, GM, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.39, pp.165 - 169, 2001-12 |
FORMATION OF MISFIT DISLOCATIONS DURING ZN-DIFFUSION-INDUCED INTERMIXING OF A GAINASP/INP HETEROSTRUCTURE Park, HyoHoon; NAM, ES; LEE, YT; LEE, EH; Lee, JeongYong, APPLIED PHYSICS LETTERS, v.59, no.16, pp.2025 - 2027, 1991-10 |
Formation of misfit dislocations in high indium content InxGa1-xN grown on GaN Lee, Jeong Yong, The 10th Seoul International Symposium on the Physics of Semiconductors and Applications, pp.227 - 228, ISPSA, 2000-11-01 |
Formation of monodisperse spherical TiO2 powders by thermal hydrolysis of Ti(SO4)(2) Park, HK; Moon, YT; Kim, Do Kyung; Kim, Chong Hee, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.79, no.10, pp.2727 - 2732, 1996-10 |
Formation of nanometer-sized Cu-Sn-Se particles in Cu2ZnSnSe4 thin-films and their effect on solar cell efficiency Schwarz, Torsten; Cojocaru-Miredin, Oana; Mousel, Marina; Redinger, Alex; Raabe, Dierk; Choi, Pyuck-Pa, ACTA MATERIALIA, v.132, pp.276 - 284, 2017-06 |
Formation of p+ CdTe contact with Cu2Te electrode and its stability in CdTe cells Yun, Jae Ho; Kim, Ki Hwan; Lee, DY; Ahn, Byung Tae; Ohno, TR, 29th IEEE Photovoltaic Specialists Conference, pp.543 - 546, 2002-05-19 |
Formation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method Son, HY; Gam, SA; Paik, Kyung-Wook, Formation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method, pp.147 - 152, 2004-12 |
Formation of Pb/63Sn solder bumps using a solder droplet jetting method Son, HY; Nah, JW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.28, no.3, pp.274 - 281, 2005-07 |
FORMATION OF PHOSPHIDES IN P-DOPED 304L STAINLESS-STEEL SUK, JI; YOON, YC; Hong, Soon-Hyung; NAM, SW, MATERIALS LETTERS, v.13, no.2-3, pp.161 - 165, 1992-03 |
Formation of PZT Ferroelectric thin Films by MOCVD 김호기, The Korea ceram. Soc., 6th Electronic Ceramic Symposium, 1992 |
Formation of ReSi1.75 thin films on si substrates by using Ta getter Dow, Hwan-Soo; Oh, Min-Wook; Song, Seong-Hun; Kim, Min-Chul; Wee, Dang-Moon, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.45, no.6, pp.383 - 388, 2007-06 |
Formation of residual porosities during liquid phase sintering of W-Ni-Fe Yoon, Duk Yong, Sintering '85, pp.173 -, 1987 |
Formation of Sn-multiwalled carbon nanotube composite layer for the application of thermal interface materials Lee, JS; Vaidyanathan, S; Jeon, Duk Young, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 123, 2007-11-19 |
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