Showing results 11 to 12 of 12
Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
반응성 스퍼터링법에 의한 $Pb(Zr,Ti)O_3$ 압전 박막의 제조 및 특성평가 = Preparation and characterization of $Pb(Zr,Ti)O_3$ piezoelectric thin films by reactive sputteringlink 김혁환; Kim, Hyuk-Hwan; et al, 한국과학기술원, 2001 |
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