Thermally Induced Deformation Measurement of Through-Silicon Via (TSV) Structures using an Atomic Force Microscope (AFM) Moiré Method
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jang, Jae-Won | ko |
| dc.contributor.author | Lee, Soon-Bok | ko |
| dc.date.accessioned | 2013-03-29T09:37:45Z | - |
| dc.date.available | 2013-03-29T09:37:45Z | - |
| dc.date.created | 2012-07-04 | - |
| dc.date.created | 2012-07-04 | - |
| dc.date.created | 2012-07-04 | - |
| dc.date.issued | 2012-08-20 | - |
| dc.identifier.citation | IEEE Nano 2012 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/169815 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Thermally Induced Deformation Measurement of Through-Silicon Via (TSV) Structures using an Atomic Force Microscope (AFM) Moiré Method | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000309933900279 | - |
| dc.identifier.scopusid | 2-s2.0-84869164920 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | IEEE Nano 2012 | - |
| dc.identifier.conferencecountry | UK | - |
| dc.identifier.conferencelocation | Birmingham | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Jang, Jae-Won | - |
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