Temperature- and bus traffic- aware data placement in 3D-stacked cache
- Publisher
- IEEE/IFIP
- Issue Date
- 2010-09-27
- Language
- English
- Citation
2010 18th IEEE/IFIP International Conference on VLSI and System-on-Chip, VLSI-SoC 2010, pp.352 - 357
- Appears in Collection
- EE-Conference Papers(학술회의논문)
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