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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Low temperature hybrid bonding using self-alignment

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dc.contributor.authorLee J.H.-
dc.contributor.authorHa T.H.-
dc.contributor.authorLee C.W.-
dc.contributor.authorSong J.-Y.-
dc.contributor.authorYoo C.D.-
dc.date.accessioned2013-03-28T08:38:47Z-
dc.date.available2013-03-28T08:38:47Z-
dc.date.created2012-02-06-
dc.date.issued2010-09-13-
dc.identifier.citation3rd Electronics System Integration Technology Conference, ESTC 2010, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/164210-
dc.languageENG-
dc.titleLow temperature hybrid bonding using self-alignment-
dc.typeConference-
dc.identifier.scopusid2-s2.0-78651312468-
dc.type.rimsCONF-
dc.citation.publicationname3rd Electronics System Integration Technology Conference, ESTC 2010-
dc.identifier.conferencecountryGermany-
dc.identifier.conferencecountryGermany-
dc.contributor.localauthorYoo C.D.-
dc.contributor.nonIdAuthorLee J.H.-
dc.contributor.nonIdAuthorHa T.H.-
dc.contributor.nonIdAuthorLee C.W.-
dc.contributor.nonIdAuthorSong J.-Y.-
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ME-Conference Papers(학술회의논문)
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