The effect of through-the-thickness holes on a reference-free damage diagnosis technique
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Chang Gil | ko |
| dc.contributor.author | Sohn, Hoon | ko |
| dc.date.accessioned | 2013-03-28T06:33:38Z | - |
| dc.date.available | 2013-03-28T06:33:38Z | - |
| dc.date.created | 2012-10-24 | - |
| dc.date.created | 2012-10-24 | - |
| dc.date.issued | 2008-03-09 | - |
| dc.identifier.citation | SPIE International Symposia, Smart Structures & Materials and Nondestructive Evaluation for Health Monitoring and Diagnostics | - |
| dc.identifier.uri | http://hdl.handle.net/10203/163519 | - |
| dc.language | English | - |
| dc.publisher | SPIE | - |
| dc.title | The effect of through-the-thickness holes on a reference-free damage diagnosis technique | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | SPIE International Symposia, Smart Structures & Materials and Nondestructive Evaluation for Health Monitoring and Diagnostics | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Diego, CA | - |
| dc.contributor.localauthor | Sohn, Hoon | - |
| dc.contributor.nonIdAuthor | Lee, Chang Gil | - |
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