Embedded Passives Fabricated on LTCC and Application of Photo-imageable Thick Film TechnologyEmbedded Passives Fabricated on LTCC and Application of Photo-imageable Thick Film Technology

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Issue Date
2007-04-24
Language
ENG
Citation

3rd Ceramic Interconnect and Ceramic Microsystems Technology, pp.0 - 0

URI
http://hdl.handle.net/10203/159409
Appears in Collection
EE-Conference Papers(학술회의논문)
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