Embedded Passives Fabricated on LTCC and Application of Photo-imageable Thick Film TechnologyEmbedded Passives Fabricated on LTCC and Application of Photo-imageable Thick Film Technology
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Chul Soon | - |
| dc.date.accessioned | 2013-03-27T05:11:18Z | - |
| dc.date.available | 2013-03-27T05:11:18Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-04-24 | - |
| dc.identifier.citation | 3rd Ceramic Interconnect and Ceramic Microsystems Technology, v., no., pp.0 - 0 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/159409 | - |
| dc.language | ENG | - |
| dc.title | Embedded Passives Fabricated on LTCC and Application of Photo-imageable Thick Film Technology | - |
| dc.title.alternative | Embedded Passives Fabricated on LTCC and Application of Photo-imageable Thick Film Technology | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 0 | - |
| dc.citation.endingpage | 0 | - |
| dc.citation.publicationname | 3rd Ceramic Interconnect and Ceramic Microsystems Technology | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Park, Chul Soon | - |
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