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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

SU-8 removal method for an electroplated micro mechanical structure with a HAR SU-8 mold

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dc.contributor.authorLee, JS-
dc.contributor.authorLee, Seung Seob-
dc.date.accessioned2013-03-27T03:01:33Z-
dc.date.available2013-03-27T03:01:33Z-
dc.date.created2012-02-06-
dc.date.issued2008-06-22-
dc.identifier.citationAsia-Pacific Conference on Transducers and Micro-Nano Technology, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/158491-
dc.languageENG-
dc.titleSU-8 removal method for an electroplated micro mechanical structure with a HAR SU-8 mold-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameAsia-Pacific Conference on Transducers and Micro-Nano Technology-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorLee, Seung Seob-
dc.contributor.nonIdAuthorLee, JS-
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ME-Conference Papers(학술회의논문)
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