고밀도 핀배열의 IT 부품 실장을 위한 열압착 초음파 본딩 기술Thermo-Compression Ultrasonic Bonding Technology for Mounting IT Components with High-Density Pin Counts
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 장태영 | - |
| dc.contributor.author | 윤원수 | - |
| dc.contributor.author | 김경수 | - |
| dc.date.accessioned | 2013-03-27T01:54:03Z | - |
| dc.date.available | 2013-03-27T01:54:03Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2008 | - |
| dc.identifier.citation | 한국정밀공학회 2008년도 추계학술대회 논문집, v., no., pp.47 - 48 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/158055 | - |
| dc.language | KOR | - |
| dc.publisher | 한국정밀공학회 | - |
| dc.title | 고밀도 핀배열의 IT 부품 실장을 위한 열압착 초음파 본딩 기술 | - |
| dc.title.alternative | Thermo-Compression Ultrasonic Bonding Technology for Mounting IT Components with High-Density Pin Counts | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 47 | - |
| dc.citation.endingpage | 48 | - |
| dc.citation.publicationname | 한국정밀공학회 2008년도 추계학술대회 논문집 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 김경수 | - |
| dc.contributor.nonIdAuthor | 장태영 | - |
| dc.contributor.nonIdAuthor | 윤원수 | - |
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