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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Pre-bonding method using self-alignment effect for multichip packaging

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dc.contributor.authorLee J.H.-
dc.contributor.authorHa T.H.-
dc.contributor.authorLee C.W.-
dc.contributor.authorSong J.-Y.-
dc.contributor.authorCha M.S.-
dc.contributor.authorYoo C.D.-
dc.date.accessioned2013-03-27T00:48:33Z-
dc.date.available2013-03-27T00:48:33Z-
dc.date.created2012-02-06-
dc.date.issued2009-11-17-
dc.identifier.citation2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, v., no., pp.118 - 123-
dc.identifier.urihttp://hdl.handle.net/10203/157617-
dc.languageENG-
dc.titlePre-bonding method using self-alignment effect for multichip packaging-
dc.typeConference-
dc.identifier.scopusid2-s2.0-77949410847-
dc.type.rimsCONF-
dc.citation.beginningpage118-
dc.citation.endingpage123-
dc.citation.publicationname2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorYoo C.D.-
dc.contributor.nonIdAuthorLee J.H.-
dc.contributor.nonIdAuthorHa T.H.-
dc.contributor.nonIdAuthorLee C.W.-
dc.contributor.nonIdAuthorSong J.-Y.-
dc.contributor.nonIdAuthorCha M.S.-
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ME-Conference Papers(학술회의논문)
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