DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jang T.-Y. | - |
dc.contributor.author | Ha C.-W. | - |
dc.contributor.author | Kim, Kyung-Soo | - |
dc.date.accessioned | 2013-03-26T01:25:59Z | - |
dc.date.available | 2013-03-26T01:25:59Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-11-17 | - |
dc.identifier.citation | 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, v., no., pp.113 - 117 | - |
dc.identifier.uri | http://hdl.handle.net/10203/156759 | - |
dc.language | ENG | - |
dc.title | Thermosonic flip chip bonding using lateral vibration with anisotropic conductive film (ACF) | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-77949356595 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 113 | - |
dc.citation.endingpage | 117 | - |
dc.citation.publicationname | 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009 | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Kim, Kyung-Soo | - |
dc.contributor.nonIdAuthor | Jang T.-Y. | - |
dc.contributor.nonIdAuthor | Ha C.-W. | - |
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