Improving reliability of lateral thermosonic flip-chip bonding with ACF
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ha C.-W. | ko |
| dc.contributor.author | Kim, Kyung-Soo | ko |
| dc.date.accessioned | 2013-03-26T00:55:15Z | - |
| dc.date.available | 2013-03-26T00:55:15Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-12-09 | - |
| dc.identifier.citation | 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.36 - 39 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/156559 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | Improving reliability of lateral thermosonic flip-chip bonding with ACF | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000288404200008 | - |
| dc.identifier.scopusid | 2-s2.0-77950940546 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 36 | - |
| dc.citation.endingpage | 39 | - |
| dc.citation.publicationname | 2009 11th Electronic Packaging Technology Conference, EPTC 2009 | - |
| dc.identifier.conferencecountry | SI | - |
| dc.identifier.conferencelocation | Singapore | - |
| dc.contributor.localauthor | Kim, Kyung-Soo | - |
| dc.contributor.nonIdAuthor | Ha C.-W. | - |
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