Filling of very fine via holes for three dimensional packaging by using ionized metal plasma sputtering and electroplating
- Publisher
- 123
- Issue Date
- 2007-11-19
- Language
- English
- Citation
International Conference on Electronic Materials and Packaging 2007, EMAP 2007
- ISSN
- 0021-4922
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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