Filling of very fine via holes for three dimensional packaging by using ionized metal plasma sputtering and electroplating
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Cho, BH | ko |
| dc.contributor.author | Yun, JJ | ko |
| dc.contributor.author | Lee, Won-Jong | ko |
| dc.date.accessioned | 2013-03-19T03:13:30Z | - |
| dc.date.available | 2013-03-19T03:13:30Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-11-19 | - |
| dc.identifier.citation | International Conference on Electronic Materials and Packaging 2007, EMAP 2007 | - |
| dc.identifier.issn | 0021-4922 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/155181 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | Filling of very fine via holes for three dimensional packaging by using ionized metal plasma sputtering and electroplating | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000259300000022 | - |
| dc.identifier.scopusid | 2-s2.0-51249103625 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | International Conference on Electronic Materials and Packaging 2007, EMAP 2007 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Daejeon | - |
| dc.contributor.localauthor | Lee, Won-Jong | - |
| dc.contributor.nonIdAuthor | Cho, BH | - |
| dc.contributor.nonIdAuthor | Yun, JJ | - |
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