Effect of process conditions on adhesion between stamp and polymer film used in thermal nanoimprint lithography
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim K.S. | ko |
| dc.contributor.author | Kang J.H. | ko |
| dc.contributor.author | Kim, Kyung-Woong | ko |
| dc.date.accessioned | 2013-03-19T01:18:18Z | - |
| dc.date.available | 2013-03-19T01:18:18Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-10-22 | - |
| dc.identifier.citation | ASME/STLE International Joint Tribology Conference, IJTC 2007, pp.865 - 866 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/154410 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | Effect of process conditions on adhesion between stamp and polymer film used in thermal nanoimprint lithography | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000254339300226 | - |
| dc.identifier.scopusid | 2-s2.0-43449110137 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 865 | - |
| dc.citation.endingpage | 866 | - |
| dc.citation.publicationname | ASME/STLE International Joint Tribology Conference, IJTC 2007 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Diego, CA | - |
| dc.contributor.localauthor | Kim, Kyung-Woong | - |
| dc.contributor.nonIdAuthor | Kim K.S. | - |
| dc.contributor.nonIdAuthor | Kang J.H. | - |
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