Effect of Thermal Conductivity on its Thermal Fatigue Behavior of Solder Joints under Power Cycling Condition

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Issue Date
2004
Language
KOR
Citation

2004 KSME conference of Materials and Fracture Division KSME04MF30, pp.176 - 184

URI
http://hdl.handle.net/10203/149446
Appears in Collection
ME-Conference Papers(학술회의논문)
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