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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads

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dc.contributor.authorKim, IH-
dc.contributor.authorLee, Soon-Bok-
dc.date.accessioned2013-03-18T14:20:29Z-
dc.date.available2013-03-18T14:20:29Z-
dc.date.created2012-02-06-
dc.date.issued2006-
dc.identifier.citation대한기계학회 신뢰성부문 및 한국신뢰성학회 공동학술대회, v., no., pp.64 - 71-
dc.identifier.urihttp://hdl.handle.net/10203/149226-
dc.languageKOR-
dc.titleReliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage64-
dc.citation.endingpage71-
dc.citation.publicationname대한기계학회 신뢰성부문 및 한국신뢰성학회 공동학술대회-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorKim, IH-
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ME-Conference Papers(학술회의논문)
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