Measuring interfacial fracture toughness of Si wafer/glass interface by blade test
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 엄윤용 | - |
| dc.date.accessioned | 2013-03-18T13:47:43Z | - |
| dc.date.available | 2013-03-18T13:47:43Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2004 | - |
| dc.identifier.citation | 한국 마이크로 전자및 패키징 학회, v., no., pp.11 - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/148983 | - |
| dc.language | KOR | - |
| dc.title | Measuring interfacial fracture toughness of Si wafer/glass interface by blade test | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 11 | - |
| dc.citation.publicationname | 한국 마이크로 전자및 패키징 학회 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 엄윤용 | - |
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