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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

A study on reliability of flip-chip solder joints using Pb-free solders and electroless Ni-P UBMs

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dc.contributor.authorLee, Soon-Bok-
dc.contributor.authorPaik, KW-
dc.contributor.authorJeon, YD-
dc.contributor.authorYang, SY-
dc.contributor.authorKwon, YM-
dc.date.accessioned2013-03-18T12:59:59Z-
dc.date.available2013-03-18T12:59:59Z-
dc.date.created2012-02-06-
dc.date.issued2005-
dc.identifier.citationPan Pacific Microelectronics symposium, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/148596-
dc.languageENG-
dc.titleA study on reliability of flip-chip solder joints using Pb-free solders and electroless Ni-P UBMs-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnamePan Pacific Microelectronics symposium-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorPaik, KW-
dc.contributor.nonIdAuthorJeon, YD-
dc.contributor.nonIdAuthorYang, SY-
dc.contributor.nonIdAuthorKwon, YM-
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ME-Conference Papers(학술회의논문)
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