DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Kim, Ilho | - |
dc.date.accessioned | 2013-03-17T10:56:05Z | - |
dc.date.available | 2013-03-17T10:56:05Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2006 | - |
dc.identifier.citation | EMAP2006, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/142560 | - |
dc.language | ENG | - |
dc.title | A comparative study on thermal and mechanical fatigue behavior for Lead-Free Solder Joints | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | EMAP2006 | - |
dc.identifier.conferencecountry | Hong Kong | - |
dc.identifier.conferencecountry | Hong Kong | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Kim, Ilho | - |
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