DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Yoon, Ji-Young | - |
dc.contributor.author | Kim, Sung-Yeol | - |
dc.date.accessioned | 2013-03-17T09:33:47Z | - |
dc.date.available | 2013-03-17T09:33:47Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005 | - |
dc.identifier.citation | Tokyo Tech-KAIST joint workshop, v., no., pp.82 - 84 | - |
dc.identifier.uri | http://hdl.handle.net/10203/142075 | - |
dc.language | ENG | - |
dc.title | The Effect of Thickness on Thermal Properties and Behavior of Submicron Copper Film on Polymer Substrate | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 82 | - |
dc.citation.endingpage | 84 | - |
dc.citation.publicationname | Tokyo Tech-KAIST joint workshop | - |
dc.identifier.conferencecountry | Japan | - |
dc.identifier.conferencecountry | Japan | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Yoon, Ji-Young | - |
dc.contributor.nonIdAuthor | Kim, Sung-Yeol | - |
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