Measurement of Thermomechanical Behavior of Solder Joint under Power Cycling Condition using Moire Interferometry
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.contributor.author | Yang, Se Young | - |
| dc.contributor.author | Kim, Ilho | - |
| dc.date.accessioned | 2013-03-17T04:40:19Z | - |
| dc.date.available | 2013-03-17T04:40:19Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2004 | - |
| dc.identifier.citation | SEM'04, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/139912 | - |
| dc.language | ENG | - |
| dc.title | Measurement of Thermomechanical Behavior of Solder Joint under Power Cycling Condition using Moire Interferometry | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | SEM'04 | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Yang, Se Young | - |
| dc.contributor.nonIdAuthor | Kim, Ilho | - |
- Appears in Collection
- ME-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.