DSpace at KOASAS: Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology

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Kim, SY / Oh, TS / Lee, Won-Jong researcher / Kim, YH

Issue Date: 2006-08-26

Language: ENG

Citation: 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

URI: http://hdl.handle.net/10203/139865

Appears in Collection: MS-Conference Papers(학술회의논문)

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Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology

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