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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology

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dc.contributor.authorKim, SY-
dc.contributor.authorOh, TS-
dc.contributor.authorLee, Won-Jong-
dc.contributor.authorKim, YH-
dc.date.accessioned2013-03-17T04:31:59Z-
dc.date.available2013-03-17T04:31:59Z-
dc.date.created2012-02-06-
dc.date.issued2006-08-26-
dc.identifier.citation2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/139865-
dc.languageENG-
dc.titleLow temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology-
dc.typeConference-
dc.identifier.scopusid2-s2.0-34948855305-
dc.type.rimsCONF-
dc.citation.publicationname2006 7th International Conference on Electronics Packaging Technology, ICEPT '06-
dc.identifier.conferencecountryChina-
dc.identifier.conferencecountryChina-
dc.contributor.localauthorLee, Won-Jong-
dc.contributor.nonIdAuthorKim, SY-
dc.contributor.nonIdAuthorOh, TS-
dc.contributor.nonIdAuthorKim, YH-
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MS-Conference Papers(학술회의논문)
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