Anisotropic Conductive Film (ACF) Flip-chip Interconnect in Over GHz RF Clock Distributioin System
- Publisher
- IEEE
- Issue Date
- 2000-06
- Language
- English
- Citation
IEEE Adhesive 2000, pp.153 - 158
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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