Experimental Determination of Thin Film Adhesion Using 4 Point Bending Specimen
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Earmme, Youn-Young | ko |
| dc.date.accessioned | 2013-03-16T18:34:32Z | - |
| dc.date.available | 2013-03-16T18:34:32Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-11 | - |
| dc.identifier.citation | Third International Symposium on Electronics Materials and Packaging 2001, pp.376 - 381 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/134387 | - |
| dc.language | English | - |
| dc.publisher | Third International Symposium on Electronics Materials and Packaging 2001 | - |
| dc.title | Experimental Determination of Thin Film Adhesion Using 4 Point Bending Specimen | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000175586500067 | - |
| dc.identifier.scopusid | 2-s2.0-84901634664 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 376 | - |
| dc.citation.endingpage | 381 | - |
| dc.citation.publicationname | Third International Symposium on Electronics Materials and Packaging 2001 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Jeju | - |
| dc.contributor.localauthor | Earmme, Youn-Young | - |
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