DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, DS | - |
dc.contributor.author | Lee, KC | - |
dc.contributor.author | Lee, Seung Seob | - |
dc.contributor.author | Kwon, TH | - |
dc.date.accessioned | 2013-03-16T14:49:22Z | - |
dc.date.available | 2013-03-16T14:49:22Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2002-04 | - |
dc.identifier.citation | 5th Int. Conf. Modeling and Simulation of Microsystems, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/132289 | - |
dc.language | ENG | - |
dc.title | Transient Filling Flow into Microchannels Considering Surface Tension | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 5th Int. Conf. Modeling and Simulation of Microsystems | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Lee, Seung Seob | - |
dc.contributor.nonIdAuthor | Kim, DS | - |
dc.contributor.nonIdAuthor | Lee, KC | - |
dc.contributor.nonIdAuthor | Kwon, TH | - |
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