DSpace at KOASAS
College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Solder Alloy Design and Interfacial Reaction at the Interconnection in the Electronic Packaging

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 639
  • Download : 0
Export
Lee, Hyuck Moresearcher / Choi, WKresearcher
Issue Date
1999-03
Language
KOR
Citation

KEPCON’99, pp.21 - 38

URI
http://hdl.handle.net/10203/132253
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

Display Full Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0