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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Solder Alloy Design and Interfacial Reaction at the Interconnection in the Electronic Packaging

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dc.contributor.authorLee, Hyuck Mo-
dc.contributor.authorChoi, WK-
dc.date.accessioned2013-03-16T14:41:56Z-
dc.date.available2013-03-16T14:41:56Z-
dc.date.created2012-02-06-
dc.date.issued1999-03-
dc.identifier.citationKEPCON’99, v., no., pp.21 - 38-
dc.identifier.urihttp://hdl.handle.net/10203/132253-
dc.languageKOR-
dc.titleSolder Alloy Design and Interfacial Reaction at the Interconnection in the Electronic Packaging-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage21-
dc.citation.endingpage38-
dc.citation.publicationnameKEPCON’99-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorLee, Hyuck Mo-
dc.contributor.nonIdAuthorChoi, WK-
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MS-Conference Papers(학술회의논문)
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