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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Measurement of Creep and Relaxation Behaviors of CSP using Moire Interferometry

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dc.contributor.authorHam, SJko
dc.contributor.authorLee, Soon-Bokko
dc.contributor.authorKim, DHko
dc.date.accessioned2013-03-16T13:05:02Z-
dc.date.available2013-03-16T13:05:02Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2000-06-
dc.identifier.citationExperimental/Numerical Mechanics in Electronic Packaging, pp.738 - 739-
dc.identifier.urihttp://hdl.handle.net/10203/131553-
dc.languageEnglish-
dc.publisherExperimental/Numerical Mechanics in Electronic Packaging-
dc.titleMeasurement of Creep and Relaxation Behaviors of CSP using Moire Interferometry-
dc.typeConference-
dc.identifier.wosid000176203100198-
dc.type.rimsCONF-
dc.citation.beginningpage738-
dc.citation.endingpage739-
dc.citation.publicationnameExperimental/Numerical Mechanics in Electronic Packaging-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationOrlando-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorHam, SJ-
dc.contributor.nonIdAuthorKim, DH-
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ME-Conference Papers(학술회의논문)
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