Reliability Evaluation of Solder joints in Electronics Packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.date.accessioned | 2013-03-16T11:51:25Z | - |
| dc.date.available | 2013-03-16T11:51:25Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002 | - |
| dc.identifier.citation | Korea-Usa Electronic Packaging Symposium, v., no., pp.110 - 129 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/131001 | - |
| dc.language | KOR | - |
| dc.title | Reliability Evaluation of Solder joints in Electronics Packaging | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 110 | - |
| dc.citation.endingpage | 129 | - |
| dc.citation.publicationname | Korea-Usa Electronic Packaging Symposium | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
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