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(A) study on the mechanical reliability of solder joints in electronic packaging = 전자 패키지 소더 조인트의 기계적 신뢰성에 관한 연구link Ham, Suk-Jin; 함석진; et al, 한국과학기술원, 2002 |
Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구 = A study on the thermal deformations of wafer-level CSP assembly under power cyclinglink 조만석; Cho, Man-Seok; et al, 한국과학기술원, 2001 |
Reduction of CO2 emission for solar power backup by direct integration of oxy-combustion supercritical CO2 power cycle with concentrated solar power Son, Seongmin; Heo, Jin Young; Kim, Nam Il; Jamal, Aqil; Lee, Jeong-Ik, ENERGY CONVERSION AND MANAGEMENT, v.201, no.1, 2019-12 |
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