Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject electronic packaging
Showing results 1 to 8 of 8
| A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry Park, Jin-Hyoung; Jang, Kyung-Woon; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.33, no.1, pp.215 - 221, 2010-03 |
| Development of Inclined Conductive Bump for Flip-Chip Interconnection Park, Ah-Young; Park, Seungbae; Yoo, Choong-Don, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.2, pp.207 - 216, 2015-02 |
| Experimental techniques for fatigue reliability of BGA solder bumps in electronic packaging Lee, Soon-Bok; Park, TS; Ham, SJ, JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, v.43, no.4, pp.400 - 407, 2000-10 |
| Interfacial characteristics of solder joint in electronic packaging = 전자 패키징 솔더 접합부의 계면 특성 : 그래핀과 플렉시블 기판의 응용link Ko, Yong-Ho; 고용호; et al, 한국과학기술원, 2017 |
| Soldering method using longitudinal ultrasonic Kim, Jung Ho; Lee, J; Yoo, Choong-Don, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, no.3, pp.493 - 498, 2005-09 |
| Thermosonic bonding of crossed strip Au bumps Kim, JH; Kim, BC; Lee, J; Yoo, CD, SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, v.10, no.5, pp.604 - 609, 2005 |
| 무연 소더에서의 재료 거동 및 열피로 특성에 대한 미세 구조 영향 = Effects of microstructure on material behaviors and fatigue properties of lead-free solder materialslink 황태경; Hwang, Tae-Kyung; et al, 한국과학기술원, 2007 |
| 스텔스 다이싱 공정 하의 DAF 물성 및 칩 형상에 따른 칩 간격 경향성 분석 = Tendency analysis of kerf width depending on DAF properties and chip's shape in the stealth dicing processlink 최선아; Choi, Sun A; et al, 한국과학기술원, 2016 |
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