Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject Thinned silicon wafers▼aThree-point bending test▼aFlexural properties▼aSize effect▼aCrystallographic orientation▼aWeibull modulus▼aWarpage
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| Effects of subsurface damage layer on flexural properties and reliability of thinned silicon wafers = 연마된 표면 아래의 손상층이 얇은 실리콘 웨이퍼의 굽힘 물성 및 신뢰성에 미치는 영향link Gu, Chang-Yeon; Kim, Taek-Soo; et al, 한국과학기술원, 2023 |
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