학위논문(석사) - 한국과학기술원 : 기계공학과, 2023.2,[v, 56 p. :]
Thinned silicon wafers▼aThree-point bending test▼aFlexural properties▼aSize effect▼aCrystallographic orientation▼aWeibull modulus▼aWarpage; 얇은 실리콘 웨이퍼▼a3 점 굽힘 시험법▼a굽힘 물성▼a두께 영향▼a결정학적 방향▼a와이블 형상계수▼a워피지
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