Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject RELIABILITY
Showing results 1 to 35 of 35
| A comparative study of the fatigue Behavior of SnAgCu and SnPb solder joints Kim, IH; Park, TS; Yang, SY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, v.297-300, pp.831 - 836, 2005 |
| A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry Park, Jin-Hyoung; Jang, Kyung-Woon; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.33, no.1, pp.215 - 221, 2010-03 |
| A study on the thermal fatigue behavior of solder joints under power cycling conditions Yang, Se Young; Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.1, pp.3 - 12, 2008-03 |
| Advanced Cu/Polymer Hybrid Bonding System for Fine-Pitch 3D Stacking Devices Park, Juseong; Kang, Sukkyung; Kim, Myeong Eun; Kim, Nam Jun; Kim, Jungkyun; Kim, Sanha; Kim, Kyung Min, ADVANCED MATERIALS TECHNOLOGIES, v.8, no.20, 2023-10 |
Artificial Neural Network Learns Clinical Assessment of Spasticity in Modified Ashworth Scale Park, Jeong-Ho; Kim, Yushin; Lee, Kwang-Jae; Yoon, Yong-Soon; Kang, Si Hyun; Kim, Heesang; Park, Hyung-Soon, ARCHIVES OF PHYSICAL MEDICINE AND REHABILITATION, v.100, no.10, pp.1907 - 1915, 2019-10 |
| Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji-Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.208 - 215, 2016-02 |
| Changes of Shoulder, Elbow, and Wrist Stiffness Matrix Post Stroke Zhang, Li-Qun; Son, Jongsang; Park, Hyung-Soon; Kang, Sang Hoon; Lee, Yunju; Ren, Yupeng, IEEE TRANSACTIONS ON NEURAL SYSTEMS AND REHABILITATION ENGINEERING, v.25, no.7, pp.844 - 851, 2017-07 |
| Characterization of Spastic Ankle Flexors Based on Viscoelastic Modeling for Accurate Diagnosis Shin, Won-Seok; Chang, Handdeut; Kim, Sangjoon J.; Kim, Jung, INTERNATIONAL JOURNAL OF CONTROL AUTOMATION AND SYSTEMS, v.18, no.1, pp.102 - 113, 2020-01 |
| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Concept design and cost benefit analysis of pile-guide mooring system for an offshore LNG bunkering terminal Lee, Seong-Yeob; Jo, Choonghee; Pettersen, Bjonar; Chung, Hyun; Kim, San; Chang, Daejun, OCEAN ENGINEERING, v.154, pp.59 - 69, 2018-04 |
| Concept of allowable load set and its application for evaluation of structural integrity Kwak, Byung Man; Kim, JH, MECHANICS OF STRUCTURES AND MACHINES, v.30, no.2, pp.213 - 247, 2002-11 |
| Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene Ko, Yong Ho; Lee, Jong-Dae; Yoon, Taeshik; Lee, Chang-Woo; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.8, no.8, pp.5679 - 5686, 2016-03 |
| Cryogenic characteristics of chopped glass fiber reinforced polyurethane foam Yu, Youngho; Choi, Ilbeom; Nam, Soohyun; Lee, Dai Gil, COMPOSITE STRUCTURES, v.107, pp.476 - 481, 2014-01 |
| Cryogenic impact resistance of chopped fiber reinforced polyurethane foam Yu, Young Ho; Nam, Soohyun; Lee, Dongyoung; Lee, Dai Gil, COMPOSITE STRUCTURES, v.132, pp.12 - 19, 2015-11 |
| Cryogenic sandwich-type insulation board composed of E-glass/epoxy composite and polymeric foams Choi, Ilbeom; Yu, Young Ho; Lee, Dai Gil, COMPOSITE STRUCTURES, v.102, pp.61 - 71, 2013-08 |
| Determination of sample size for input variables in RBDO through bi-objective confidence-based design optimization under input model uncertainty Jung, Yongsu; Cho, Hyunkyoo; Duan, Zunyi; Lee, Ikjin, STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION, v.61, no.1, pp.253 - 266, 2020-01 |
| Effects of graphene oxide on the electromigration lifetime of lead-free solder joints Ko, Yong Ho; Son, Kirak; Kim, Gahui; Park, Young-Bae; Yu, Dong-Yurl; Bang, Junghwan; Kim, Taek-Soo, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.3, pp.2334 - 2341, 2019-02 |
| Effects of walking speed and slope on pedobarographic findings in young healthy adults Koo, Seungbum; Park, Moon Seok; Chung, Chin Youb; Yoon, Ji Soo; Park, Chulhee; Lee, Kyoung Min, PLOS ONE, v.14, no.7, pp.e0220073, 2019-07 |
| Elastic region of an ACF joint for thermosonic flip-chip bonding Ha, Chang-Wan; Jang, Tae-Young; Kim, Kyung-Rok; Yun, Won-Soo; Kim, Kyung-Soo, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.21, no.9, 2011-09 |
| Examining impairment of adaptive compensation for stabilizing motor repetitions in stroke survivors Kim, Yushin; Koh, Kyung; Yoon, BumChul; Kim, Woo-Sub; Shin, Joon-Ho; Park, Hyung-Soon; Shim, Jae Kun, EXPERIMENTAL BRAIN RESEARCH, v.235, no.12, pp.3543 - 3552, 2017-12 |
| Fatigue of polymer-supported Ag thin films Sim, Gidong; Hwangbo, Yun; Kim, Hyun-Ho; Lee, Soon-Bok; Vlassak, Joost J., SCRIPTA MATERIALIA, v.66, no.11, pp.915 - 918, 2012-06 |
| Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials Ki, Seokkan; Shim, Jaehwan; Oh, Seungtae; Koh, Eunjoo; Seo, Donghyun; Ryu, Seunggeol; Kim, Jaechoon; et al, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.170, pp.121012, 2021-05 |
| Moisture induced interface weakening in ACF package Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12 |
| Multilevel design of experiments for statistical moment and probability calculation Lee, SH; Choi, HS; Kwak, Byung Man, STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION, v.37, pp.57 - 70, 2008-12 |
| Performance and availability of a marine generator-solid oxide fuel cell-gas turbine hybrid system in a very large ethane carrier Ahn, Junkeon; Park, Sungho; Noh, Yeelyong; Il Choi, Byung; Ryu, Jiheon; Chang, Daejun; Brendstrup, K. L. M., JOURNAL OF POWER SOURCES, v.399, pp.199 - 206, 2018-09 |
| Photocrosslinkable liquid prepolymers for flexible waveguide display applications Park, Seung Koo; Ju, Jung Jin; Kim, Jin Tae; Kim, Min-su; Moon, Jaehyun; Lee, Jeong-Ik; Chu, Hye Yong; et al, JOURNAL OF MATERIALS CHEMISTRY C, v.1, no.17, pp.2983 - 2989, 2013 |
| Radiographic Measurements Associated With the Natural Progression of the Hallux Valgus During at Least 2 Years of Follow-up Lee, Seung Yeol; Chung, Chin Youb; Park, Moon Seok; Sung, Ki Hyuk; Ahmed, Sonya; Koo, Seungbum; Kang, Dong-wan; et al, FOOT & ANKLE INTERNATIONAL, v.39, no.4, pp.463 - 470, 2018-04 |
| Remote Assessment of Post-Stroke Elbow Function Using Internet-Based Telerobotics: A Proof-of-Concept Study Kim, Jonghyun; Sin, Minki; Kim, Won-Seok; Min, Yu-Sun; Kim, Woojin; Paik, Nam-Jong; Cho, Kyujin; et al, FRONTIERS IN NEUROLOGY, v.11, 2020-12 |
| Robust design with arbitrary distributions using Gauss-type quadrature formula Lee, SH; Chen, W; Kwak, Byung Man, STRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION, v.39, pp.227 - 243, 2009-09 |
| Sampling-Based Stochastic Sensitivity Analysis Using Score Functions for RBDO Problems With Correlated Random Variables Lee, Ikjin; Choi, K. K.; Noh, Yoojeong; Zhao, Liang; Gorsich, David, JOURNAL OF MECHANICAL DESIGN, v.133, no.2, 2011-02 |
| Sex Differences in Pedobarographic Findings and Relationship between Radiographic and Pedobarographic Measurements in Young Healthy Adults Koo, Seungbum; Chun, Sangho; Lee, Kyoung Min; Cho, Byung Chae; Koo, Young-Jun; Kang, Dong-Wan; Park, Moon Seok, CLINICS IN ORTHOPEDIC SURGERY, v.10, no.2, pp.216 - 224, 2018-06 |
| Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs) Suk, Kyoung-Lim; Choo, Kyo-Sung; Kim, Sung-Jin; Kim, Jong-Soo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1182 - 1188, 2012-06 |
| Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film Kim, Kyung Rok; Ha, Chang Wan; Kim, Kyung-Soo; Yun, Won-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.3, pp.371 - 376, 2014-03 |
| Using lateral vibration for thermosonic flip-chip interconnection with anisotropic conductive film Kim, Kyung-Soo; Ha, CW; Jang, TY; Joung, SW; Yun, WS, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.20, no.10, 2010-10 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
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